T-937M Reflow Oven T937M Lead-Free Reflow Solder Oven BGA SMD SMT Rework Sation T 937M Reflow Wave Oven

The INFRARED IC HEATER T-937M is a micro processor controlled reflow-oven. It can be used for effectively soldering various SMD and BGA components. The whole soldering process can be completed automatically and it is very easy to use. This machine uses a powerful infrared emission and circulation of the hot air flow, so the temperature is being kept very accurate and evenly distributed. A windowed drawer is designed to hold the work-piece, and allows safe soldering techniques and the manipulation of SMD/BAG and other small electronic parts mounted on a PCB assembly. The T-937M may be used to automatically rework solder to correct bad solder joints, remove/replace bad components and complete small engineering models or prototypes. Model: T-937M Effective Soldering max area: 350 x 400mm Rated power: 3300W Temperature Range: 0°C-350°C Process cycle: 2~16 min Voltage: 110V~240V Frequecy: 50Hz~60Hz Product size: 473×466×290mm Packing size: 500×500×300mm Net weight: 20.7kg Gross weight: 22.5kg Packing List: 1 x Reflow Oven T-937M 1 x Power Cable 1 x Fuse 1 X CD Communcation Cable

• (1) A large infrared soldering area. Effective soldering area: 350*400mm; this increases the usage range of this machine drastically and makes it an economical investment.
• (2) Choice of different soldering cycles. Parameters of eight soldering cycles are predefined and the entire soldering process can completed automatically from Preheat, Soak and Reflow through to cool down.
• (3) Special heat up and temperature equalization with all designs. Uses up to 3300 Watts of energy efficient Infrared heating and air circulation to re-flow solder.
• (4) Ergonomic design, practical and easily operated. Good build quality but at the same time light weight and a small footprint allows the T937M to be easily bench positioned transported or stored.
• (5) Large number of available functions. The T937M can solder most boss-eyed or double-face PCB boards small parts, for example CHIP, SOP, PLCC, QFP, BGA etc. It is the ideal rework solution from single runs to on-demand small batch production.